قارن الطرق

	تحليل الحساسية مع تحليل قدرة العملية	منهجية سطح الاستجابة (RSM)
المجال	التصميم التجريبي	التصميم التجريبي
العائلة	Process / pipeline	Hypothesis test
سنة النشأة	1986–2000s (Cp/Cpk indices from Kane 1986; integration formalized in Six Sigma era)	1951
صاحب الطريقة	Synthesized from work by V. E. Kane (process capability indices) and A. Saltelli (sensitivity analysis); integrated in Six Sigma and quality engineering practice	George E. P. Box & K. B. Wilson
النوع	Quantitative engineering analysis	Second-order polynomial response surface model
المصدر التأسيسي	Montgomery, D. C. (2009). Introduction to Statistical Quality Control (6th ed.). Wiley. ISBN: 978-0470169926	Box, G. E. P. & Wilson, K. B. (1951). On the experimental attainment of optimum conditions. Journal of the Royal Statistical Society, Series B, 13(1), 1–45.
الأسماء البديلة	Sensitivity-Capability Analysis, PCA with Sensitivity Analysis, Process Capability Sensitivity Study, Cp/Cpk Sensitivity Analysis	RSM, Central Composite Design, Box-Behnken Design, CCD
ذات صلة	5	7
الملخص	Sensitivity analysis with process capability analysis is a quantitative engineering method that combines the measurement of process performance — via capability indices such as Cp and Cpk — with systematic variation of input factors to identify which factors most strongly influence whether a process meets its specification limits. It is widely used in Six Sigma projects, manufacturing quality improvement, and Design of Experiments contexts to prioritize where corrective action will yield the greatest gain in process capability.	Response Surface Methodology is a collection of statistical and mathematical techniques for building an empirical second-order polynomial model that relates a continuous response variable to two or more controllable input factors, and then locating the factor settings that optimize that response. The approach was introduced by George E. P. Box and K. B. Wilson in their landmark 1951 paper and has since become a cornerstone of process optimization across engineering, chemistry, food science, and pharmaceutics.